Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Assembly Site,Characteristics Change,Marking Molding
No.:
Description:Change LH231B manufacture site from Korea to China
Change:Test Site
No.:PCM230330004
Description:Addition of MVP process Site for DRAM Products