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友順科技股份有限公司成立於1990年，專注致力於類比IC及離散式元件Discrete研發、設計、製造、封裝、測試及行銷業務。為提供客戶完整的解決方案及具價格競爭優勢，公司經營策略採IDM資源垂直整合，期望能給予客戶最佳選擇，並創造客戶最大之經濟效益。
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process,Wafer Process
No.:PCN-230501
Description:Added Chip , To facilitate production capacity increase.
Change:Assembly Process
No.:PCN-230401
Description:2N7002 Update CHIP , To facilitate production capacity increase.
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