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友順科技股份有限公司成立於1990年，專注致力於類比IC及離散式元件Discrete研發、設計、製造、封裝、測試及行銷業務。為提供客戶完整的解決方案及具價格競爭優勢，公司經營策略採IDM資源垂直整合，期望能給予客戶最佳選擇，並創造客戶最大之經濟效益。
Change:Wafer Process
No.:PCN-230306
Description:UCL5811 Added Chip , To facilitate production capacity increase.
Change:Wafer Process
No.:PCN-230303
Description:MPSA44.MPSA44A.MMBTA44.PZTA44 Added Chip , To facilitate production capacity increase.
Change:Wafer Process
No.:PCN-230303
Description:MPSA44.MPSA44A.MMBTA44.PZTA44 Added Chip , To facilitate production capacity increase.
Change:Wafer Process
No.:PCN-230303
Description:MPSA44.MPSA44A.MMBTA44.PZTA44 Added Chip , To facilitate production capacity increase.
Change:Wafer Process
No.:PCN-230303
Description:MPSA44.MPSA44A.MMBTA44.PZTA44 Added Chip , To facilitate production capacity increase.
Change:Assembly Process
No.:PCN-230101
Description:UTC In response to increased productivity , Add molds for capacity optimization
Change:Assembly Process
No.:PCN-230101
Description:UTC In response to increased productivity , Add molds for capacity optimization
Change:Assembly Process
No.:PCN-230101
Description:UTC In response to increased productivity , Add molds for capacity optimization
Change:Assembly Process
No.:PCN-230101
Description:UTC In response to increased productivity , Add molds for capacity optimization
Change:Assembly Process
No.:PCN-230101
Description:UTC In response to increased productivity , Add molds for capacity optimization
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