Change:Assembly Process
No.:22-03-001
Description:Seiko Instruments will add a new supplier for the epoxy mold resin used in the SSP-T7 quartz crystal unit.
Change:Assembly Process
No.:22-03-001
Description:Seiko Instruments will add a new supplier for the epoxy mold resin used in the SSP-T7 quartz crystal unit.
Change:Assembly Process
No.:22-03-002
Description:Seiko Instruments will add a new supplier for the plug and case used in the VT-200 quartz crystal unit
Change:Assembly Process
No.:22-03-002
Description:Seiko Instruments will add a new supplier for the plug and case used in the VT-200 quartz crystal unit
Change:Assembly Process,Product Code,Marking Molding,Form
No.:27/2021
Description:Engineering Change Notice for LTP02-245-13B. Due to this change the model name will change.
Change:Assembly Process,Product Code,Marking Molding,Form
No.:27/2021
Description:Engineering Change Notice for LTP02-245-13B. Due to this change the model name will change.
Change:Assembly Process
No.:21/2021
Description:This is to inform you that we will change the out-of-paper detector to an alternative product
Change:Assembly Process
No.:21/2021
Description:This is to inform you that we will change the out-of-paper detector to an alternative product
Change:Assembly Process
No.:20/2021
Description:This is to inform you that we will change the out-of-paper detector to an alternative product
Change:Assembly Process
No.:22/2021
Description:This is to inform you that we will change the out-of-paper detector to an alternative product