Change:Datasheet Specifications
No.:10087
Description:QTB datasheet is updated due to increased LED brightness on the red color
Change:Datasheet Specifications
No.:10087
Description:QTB datasheet is updated due to increased LED brightness on the red color
Change:Assembly Process
No.:10037
Description:The thickness of the PCB has changed from 0.6mm to 0.8mm
Change:Assembly Process,Datasheet Specifications
No.:10035
Description:Using ANSI Bin/ the max. temperature on IR Reflow is 220C due to Eutectic process
Change:Assembly Process,Datasheet Specifications
No.:10035
Description:Using ANSI Bin/ the max. temperature on IR Reflow is 220C due to Eutectic process