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Laird(莱尔德)
国家/区域:USA
应用领域:
Automotive electronicsSmart security5G and communication networksmedicalIndustrial applicationssmart homeAerospacecomputerconsumer electronics

Laird is a global technology business focused on enabling wireless communications and intelligent systems, and providing protection for electronic components and systems. As a leader in the design, supply and support of innovative technologies, our products and solutions enable people, organizations, machines and applications to connect effectively, helping to build a world where smart technologies change the way we live. Our products are designed to meet the needs of a variety of applications in different industries, from medical to military. Our wireless communications technologies, for example, provide reliability and signal integrity regardless of environment and challenges. Our performance materials, too, eliminate the harmful effects of EMI or thermal damage and provide practical, proven solutions in applications where performance cannot be compromised. However, there is a need for everyone to create practical solutions to ensure the reliability of wireless communications, regardless of the environment or challenges.

型号
类型
变更时间
变更类型
变更编号
变更文件
变更说明
PCN
2012-03-15
Datasheet Specifications,Labeling,Marking Molding,Software Change
2-2012
Updated SiFLEX02 datasheet available from LSR,New module firmware has been released,The LSR logo will be printed in black. and The module label will now display a one significant digit revision number.
PCN
2012-03-15
Assembly Process,Labeling,Software Change
5-2012
The released devices have new firmware and changes to the labels. The LSR logo will be printed in black. The module label will now display one significant digit revision.
PCN
2012-03-15
Datasheet Specifications,Labeling,Marking Molding,Software Change
2-2012
Updated SiFLEX02 datasheet available from LSR,New module firmware has been released,The LSR logo will be printed in black. and The module label will now display a one significant digit revision number.
PCN
2012-03-15
Datasheet Specifications,Labeling,Marking Molding,Software Change
2-2012
Updated SiFLEX02 datasheet available from LSR,New module firmware has been released,The LSR logo will be printed in black. and The module label will now display a one significant digit revision number.
PDN
2012-01-03
Obsolescence Notices,Removed from Cost Book-NC/NR
Orbel Corporation is discontinuing our Specialized Contips plating process, No replacements provided.
PDN
2012-01-03
Obsolescence Notices,Removed from Cost Book-NC/NR
Orbel Corporation is discontinuing our Specialized Contips plating process, No replacements provided.
PDN
2012-01-03
Obsolescence Notices,Removed from Cost Book-NC/NR
Orbel Corporation is discontinuing our Specialized Contips plating process, No replacements provided.
PDN
2012-01-03
Obsolescence Notices,Removed from Cost Book-NC/NR
Orbel Corporation is discontinuing our Specialized Contips plating process, No replacements provided.
PDN
2012-01-03
Obsolescence Notices,Removed from Cost Book-NC/NR
Orbel Corporation is discontinuing our Specialized Contips plating process, No replacements provided.
PDN
2011-03-02
Assembly Process,Obsolescence Notices
The Deprecated part numbers above have been replaced by the new Current part numbers. The new nylon pillar tabs are redesigned, offering easier installation at both ends. Replacements provided.
RFQ
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