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BGM11S22F256GA-V2R

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Mfr.:Silicon(芯科)
Mfr. Part #:
YJC. No:
Package:6.5mm
ECCN:5A992C
Description:蓝牙 蓝牙 v4.2 RF 收发器模块 2.4GHz 集成式,芯片 表面贴装型
Datasheet:
SPECIFICATION
Category
Wireless Module
Height
1.4 mm
Operating Supply Voltage
8V 85V
Output Power
8 dBm
Operating Temperature Range
-40℃~85℃
Package
6.5mm
Interface Type
表面贴装
Length
6.5 mm
Width
6.5 mm
Shop:
1001
Settle
Cooperation
QTY[pcs]
Price[CNY/pcs]
1+
84.46993
10+
76.14454
100+
71.28027
250+
67.63207
500+
64.07741
1000+
55.65848
QTY(Multiplicity:1):
Stock:
69,000
Mpq:
1000
Delivery:
18-20 Business Day
Total:
84.47
C000034352 BGM11S22F256GA-V2R is designed and produced by Silicon(芯科), and is available for sale in the Functional Module-Function Module/development Board/solution Verification Board-Wireless Module of Yuanjingcheng Supply Chain Co., Ltd. https://www.szyjc.com, and can be purchased and ordered through the original manufacturer/agent and other formal channels. C000034352 BGM11S22F256GA-V2R reference price ¥84.4699,real-time inventory 69000. 6.5mm Height: 1.4 mm, Operating Supply Voltage: 8V 85V, Output Power: 8 dBm, Operating Temperature Range: -40℃~85℃, Package: 6.5mm, Interface Type: 表面贴装, Length: 6.5 mm, Width: 6.5 mm. You can download the Chinese information, pin diagram, datasheet data manual function manual of BGM11S22F256GA-V2R, and check the real-time inventory, price, and delivery date. In special cases, you can make inquiries for quotations, one-click purchases of bom, and selection substitutions. The platform provides data API docking, real-time inventory VMI services, and online EDI transactions.
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