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BGM113A256V21R

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Mfr.:Silicon(芯科)
Mfr. Part #:
YJC. No:
Package:
ECCN:5A992C
Description:蓝牙 蓝牙 v4.2 RF 收发器模块 2.4GHz ~ 2.484GHz 集成式,芯片 表面贴装型
Datasheet:
SPECIFICATION
Category
Wireless Module
Interface Type
表面贴装
Operating Temperature Range
-40℃~85℃
Shop:
1001
Settle
Cooperation
QTY[pcs]
Price[CNY/pcs]
1000+
61.1456
QTY(Multiplicity:1000):
Stock:
69,000
Mpq:
1000
Delivery:
14-19 Business Day
Total:
61,145.60
C000093728 BGM113A256V21R is designed and produced by Silicon(芯科), and is available for sale in the Functional Module-Function Module/development Board/solution Verification Board-Wireless Module of Yuanjingcheng Supply Chain Co., Ltd. https://www.szyjc.com, and can be purchased and ordered through the original manufacturer/agent and other formal channels. C000093728 BGM113A256V21R reference price ¥61.1456,real-time inventory 69000. Interface Type: 表面贴装, Operating Temperature Range: -40℃~85℃. You can download the Chinese information, pin diagram, datasheet data manual function manual of BGM113A256V21R, and check the real-time inventory, price, and delivery date. In special cases, you can make inquiries for quotations, one-click purchases of bom, and selection substitutions. The platform provides data API docking, real-time inventory VMI services, and online EDI transactions.
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