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铠侠是全球存储器解决方案领导者，致力于开发、生产和销售闪存及固态硬盘(SSD)。东芝公司于1987年发明了NAND闪存， 2017年4月，铠侠前身东芝存储器集团从东芝公司剥离，开创了先进的存储解决方案和服务，可丰富人们的生活并扩大社会的视野。铠侠创新的3D闪存技术BiCS FLASH™，正在塑造诸多高密度应用的未来存储方式，其中包括高级智能手机、PC、SSD、汽车和数据中心等。其零售产品覆盖存储卡、闪存盘及固态硬盘等各类闪存产品，旨在让终端用户可以再随时随地存储其数字生活。
变更类型:Obsolescence Notices
变更编号:EOL00000033
变更说明:Kioxia has announced discontinion on the mentioned products(s),some Replacements provided.
变更类型:Obsolescence Notices
变更编号:EOL00000033
变更说明:Kioxia has announced discontinion on the mentioned products(s),some Replacements provided.
变更类型:Obsolescence Notices
变更编号:EOL00000033
变更说明:Kioxia has announced discontinion on the mentioned products(s),some Replacements provided.
变更类型:Assembly Site,Materials
变更编号:19MQ-G005-1
变更说明:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
变更类型:Assembly Site,Materials
变更编号:19MQ-G005-1
变更说明:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
变更类型:Assembly Site,Materials
变更编号:19MQ-G005-1
变更说明:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
变更类型:Assembly Site,Materials
变更编号:19MQ-G005-1
变更说明:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
变更类型:Assembly Site,Materials
变更编号:19MQ-G005-1
变更说明:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
变更类型:Assembly Site,Materials
变更编号:19MQ-G005-1
变更说明:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
变更类型:Obsolescence Notices
变更编号:
变更说明:Change of wafer setup or number of possible good dies on wafer. EMEA customers only:KIOXIA SSD End Of Life.No Replacements provided.
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