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自1974以来，Central半导体已经去公司为世界各地的客户谁想要创新和可靠的半导体分立器件，并且提供最先进的半导体分立器件高科技产品，同时中央继续生产老工艺装置的长生命周期的产品很多。
Model
Type
Time
Change
No.
File
Description
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Product Code,Wafer Process
105
Reduction in the standard die thickness of discrete, small signal wafers from 9.0 mils (230µm) ± 0.6 mils (15µm), to 7.1 mils (180µm) ± 0.8 mils (20µm).
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
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