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Website:www.centralsemi.com
country/region:USA
Application:
consumer electronics5G and communication networksIndustrial applicationsmedicalPower and energy
Since 1974, Central Semiconductor has been a go-to company for customers around the world who want innovative and reliable semiconductor discretes, and provides state-of-the-art high-tech semiconductor discretes products while Central continues to produce long-life products for older process devices a lot of.
Model
Type
Time
Change
No.
File
Description
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Assembly Process
104
Devices that are presently packaged in the SOD-80 case are being manufactured in the epoxy molded SOD-123 case.
PCN
2004-11-24
Product Code,Wafer Process
105
Reduction in the standard die thickness of discrete, small signal wafers from 9.0 mils (230µm) ± 0.6 mils (15µm), to 7.1 mils (180µm) ± 0.8 mils (20µm).
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
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