Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Materials,Packing,Wafer Process,Wafer Site
No.:20231219005.1
Description:Qualification of FFAB as an additional Fab site option, die revision, and BOM Options for select devices
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing
Change:Wafer Process,Wafer Site
No.:20231221003.1
Description:Qualification of RFAB in addition to DMOS6 for METDCU processing