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TI(德州仪器)
国家/区域:USA
应用领域:
Industrial applicationsconsumer electronics5G and communication networksAutomotive electronics

Texas Instruments (TI) is one of the largest semiconductor companies in the world. We remain committed to providing innovative semiconductor technologies that help our customers develop the world's most advanced electronic products. Our analog, embedded processing and wireless technologies continue to penetrate into every aspect of life, from digital communications and entertainment to medical services, automotive systems and a wide range of applications. At the beginning of TI's development, the company's goal was to use the company's unique technological capabilities to fundamentally subvert traditional markets and create new markets. A clear main line has always been running through our development process, which is to use more and more advanced real-time signal processing technology to achieve progress from quantitative change to qualitative change, and truly and continuously change the world.

类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
型号:INA117KU
类型:PCN
变更时间:2023-12-22
变更类型:Materials,Packing,Wafer Process,Wafer Site
变更编号:20231219005.1
变更说明:Qualification of FFAB as an additional Fab site option, die revision, and BOM Options for select devices
类型:PCN
变更时间:2023-12-22
变更类型:Wafer Process,Wafer Site
变更编号:20231221003.1
变更说明:Qualification of RFAB in addition to DMOS6 for METDCU processing
RFQ
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