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Assembly Process,Product Code,Software Change
Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Assembly Process,Product Code,Software Change
Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Assembly Process,Product Code,Software Change
Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Assembly Process,Product Code,Software Change
Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Assembly Process,Product Code,Software Change
Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Assembly Process,Product Code,Software Change
Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Assembly Process,Product Code
Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Assembly Process,Product Code
Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Assembly Process,Product Code
Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Assembly Process,Product Code
Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.