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Vishay 是世界上最大的分立半导体（二极管、MOSFET 和红外光电元件）和无源电子元件（电阻器、电感器和电容器）制造商之一。这些元件应用于工业、电源、汽车、计算机、消费、电信、军事、航空航天及医疗市场几乎全部类型的电子器件和设备中。Vishay 所具有的产品创新、成功的收购战略和“一站式”服务已使公司跻身业界的全球领导者行列。能够成为 Digi-Key Electronics 的主要合作伙伴，Vishay 深感荣幸。以下是可通过 Digi-Key 购买的 Vishay 产品线部分最新产品。
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
变更类型:Datasheet Specifications,Marking Molding,Materials,Wafer Process
变更编号:PCN-DD-039-2023-REV-0
变更说明:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
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