Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.
Change:Assembly Site
No.:PCN-DD-031-2023-REV-0
Description:Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMA package (Case Outline: DO-214AC). This assembly site is located in Kaohsiung, Taiwan, and already has manufacturing experience in surface mount packaged products.