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Vishay(威世)
country/region:USA
Application:
Industrial applicationsAerospacemedical5G and communication networksconsumer electronicsAutomotive electronicscomputer

Vishay is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs and infrared optoelectronic components) and passive electronic components (resistors, inductors and capacitors). These components are used in nearly all types of electronic devices and equipment in the industrial, power supply, automotive, computer, consumer, telecommunications, military, aerospace and medical markets. Vishay's product innovation, successful acquisition strategy and "one-stop shop" service have positioned the company among the global leaders in the industry. Vishay is honored to be a premier partner of Digi-Key Electronics. Here are some of the latest products in the Vishay product line available for purchase through Digi-Key.

Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Type:PCN
Time:2023-12-22
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
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