Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.
Change:Datasheet Specifications,Marking Molding,Materials,Wafer Process
No.:PCN-DD-039-2023-REV-0
Description:The Silicon Wafer Diameter of certain part numbers will change from 4 Inch (100mm) to 6 Inch (150mm) and the frontend manufacturing process will be adapted to 6 Inch lines which includes changes in chip design.Replacements provided.