Change:Datasheet Specifications,Marking Molding
No.:PCN_FT_009
Description:The name of the Vinculo development module , VNCL0-MB1A, will be changed to Vinco.
Change:Datasheet Specifications,Marking Molding
No.:PCN_FT_009
Description:The name of the Vinculo development module , VNCL0-MB1A, will be changed to Vinco.
Change:
No.:PCN_FT_009
Description:The name of the Vinculo development module, VNCLO-MB1A, will be changed to Vinco
Change:
No.:PCN_FT_009
Description:The name of the Vinculo development module, VNCLO-MB1A, will be changed to Vinco
Change:
No.:PCN_FT_009
Description:The name of the Vinculo development module, VNCLO-MB1A, will be changed to Vinco
Change:
No.:PCN_FT_009
Description:The name of the Vinculo development module, VNCLO-MB1A, will be changed to Vinco
Change:
No.:PCN_FT_009
Description:The name of the Vinculo development module, VNCLO-MB1A, will be changed to Vinco
Change:
No.:PCN_FT_009
Description:The name of the Vinculo development module, VNCLO-MB1A, will be changed to Vinco
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.