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FTDI(飞特帝亚)
country/region:U.K.
Application:
Industrial applicationssmart homeconsumer electronicsmedicalPower and energyAutomotive electronics5G and communication networks

FTDI Chip develops innovative silicon solutions that leverage the latest technologies for enhanced interactivity. Guided by the philosophy of "designed to create simplicity," the company is able to support engineers with highly complex, feature-rich, rugged and simple-to-use product platforms. FTDI Chip has a long history of growing its Universal Serial Bus (USB) product line and has some of the most recognized products in the world. The company's Embedded Video Engine (EVE) graphics controller packages display, audio and touch functionality in a single chip, significantly reducing development time and bill of materials costs required for human-machine interface (HMI) implementations. FTDI Chip also offers a family of highly differentiated, speed-optimized microcontrollers that further enhance connectivity capabilities. FTDI Chip is a fabless semiconductor company headquartered in Glasgow, UK, with R&D facilities in Glasgow, Singapore and Taipei (Taiwan, China), and regional sales in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China) and technical support department.

Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Model:FT245RL
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Model:FT245RQ
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Model:FT232RQ
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Type:PCN
Time:2011-02-14
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Model:FT232RQ
Type:PCN
Time:2011-02-14
Change:
No.:PCN_FT_008
Description:The present Rev-B of this device will be replaced by Rev-C of the device.
RFQ
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