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强茂股份有限公司成立于1986年5月强茂拥有半导体上下游整合与自有核心技术的优势，主要从事整流二极管、功率半导体、突波抑制器等分离式元件产品的生产；搭配洞察市场趋势的观察力，不断推出符合市场需求的薄型化封装。
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303002
Description:This PCN is being issued to announce the qualification of PANJIT Semiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as an alternate assembly and test site for SOT-363 selected products.
Change:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
No.:2303003
Description:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
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