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Website:www.panjit.com.tw
country/region:Taiwan, China
Application:
5G and communication networksIndustrial applicationsAutomotive electronics
Qiangmao Co., Ltd. was established in May 1986. Qiangmao has the advantages of semiconductor upstream and downstream integration and its own core technology. It is mainly engaged in the production of rectifier diodes, power semiconductors, surge suppressors and other discrete component products; with insights into market trends With strong observation ability, we continuously introduce thin packages that meet market demand.
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
Change:Assembly Process,Materials
No.:2312002-AU
Description:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
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