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强茂股份有限公司成立于1986年5月强茂拥有半导体上下游整合与自有核心技术的优势，主要从事整流二极管、功率半导体、突波抑制器等分离式元件产品的生产；搭配洞察市场趋势的观察力，不断推出符合市场需求的薄型化封装。
型号
类型
变更时间
变更类型
变更编号
变更文件
变更说明
PCN
2023-03-28
Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
2303003
This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
PCN
2023-03-22
Assembly Process
2203001
This information note is to inform the customer that our outsourced plating supplier company name will change from "Bandl (Kushan) International Corporation" to "Suzhou Bandl Electronic Technology Co., Ltd".
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