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Assmann(阿斯曼)
country/region:美国
Application:
计算机

创立于 1969 年的 ASSMANN WSW Components 已发展壮大为机电元件、热管理产品和计算机网络配件方面的全球运营专家。 ASSMANN WSW组件组在作为全球系统供应商的产品部分标准和定制连接器,电缆组件,散热器和组装服务方面是众所周知的同时ASSMANN WSW组件在机电,冷却技术市场拥有45年的经验。 ASSMANN WSW Components 是面向电子行业和专门化贸易领域提供物流服务的最重要企业之一。 ASSMANN 专注于自身竞争能力的发展及制造能力。是连接器、单一解决方案和客户设计电缆组件的制造、采购和营销领域的优质合作伙伴。

Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Model:A-DIO-M06
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Model:A-DIO-M04
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Model:A-DIO-M07
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
Type:PCN
Time:2011-02-14
Change:Assembly Process,Materials
No.:PCN201108001
Description:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
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