变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash
变更类型:Assembly Process,Materials
变更编号:PCN201108001
变更说明:A-DIO-FSxx Tin plated shell changed to Nickel plated, A-DIO-Mxx Gold flash/Tin plated contact changed to full gold flash, changed PCB layout, A-DIO-TOPxx Gold flash/Tin plated contact changed to full gold flash