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1983年，在迈阿密成立的拉尔夫电子公司(Raltron Electronics Corporation)成为全球最大的电子产品公司之一，是世界上公认和经验丰富的频率管理产品制造商。从简单的调谐叉晶为高稳定炉控制的晶体振荡器，Raltron提供最多行业中频率管理设备的综合系列。该公司对研发的承诺，使得持续的领先创造得以实现edge晶体和振荡器的设备和技术多年。今天,Raltron提供高在价格上满足和超越客户期望的性能频率控制解决方案，质量、应用工程和客户支持。
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
Change:Assembly Process
No.:2202
Description:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
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