变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.
变更类型:Assembly Process
变更编号:2202
变更说明:Due to lack of 3mm diameter cylinder crystal base availability, the 3 x 8 mm cylinder will no longer be used inside the epoxy molded TT-SMDC (12.5 x 4.6 mm) package for frequencies 6.000 MHz and higher.