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Website:www.kioxia-holdings.com
country/region:Japan
Application:
consumer electronicsIndustrial applicationsAutomotive electronics
Kioxia is a global leader in memory solutions, dedicated to the development, production and sales of flash memory and solid-state drives (SSDs). Toshiba invented NAND flash memory in 1987. In April 2017, Kioxia's predecessor, Toshiba Memory Group, was spun off from Toshiba, creating advanced storage solutions and services that enrich people's lives and expand society's horizons. Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future storage methods for many high-density applications, including advanced smartphones, PCs, SSDs, automobiles, and data centers. Its retail products cover various flash memory products such as memory cards, flash disks and solid-state drives, aiming to allow end users to store their digital lives anytime and anywhere.
Change:Obsolescence Notices
No.:EOL00000033
Description:Kioxia has announced discontinion on the mentioned products(s),some Replacements provided.
Change:Obsolescence Notices
No.:EOL00000033
Description:Kioxia has announced discontinion on the mentioned products(s),some Replacements provided.
Change:Obsolescence Notices
No.:EOL00000033
Description:Kioxia has announced discontinion on the mentioned products(s),some Replacements provided.
Change:Assembly Site,Materials
No.:19MQ-G005-1
Description:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
Change:Assembly Site,Materials
No.:19MQ-G005-1
Description:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
Change:Assembly Site,Materials
No.:19MQ-G005-1
Description:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
Change:Assembly Site,Materials
No.:19MQ-G005-1
Description:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
Change:Assembly Site,Materials
No.:19MQ-G005-1
Description:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
Change:Assembly Site,Materials
No.:19MQ-G005-1
Description:APAC customers only: Attachment(updated) to Notification #19MQ-G005-1, The package reliability test results showed no fatal failures. The assembly site will be changed from: J-Devices Corporation ("J-Devices") to: Powertech Technology Inc. ("PTI"), The following BGA package materials will be also changed:Die attach film, Mold resin and Substrate core material
Change:Obsolescence Notices
No.:
Description:Change of wafer setup or number of possible good dies on wafer. EMEA customers only:KIOXIA SSD End Of Life.No Replacements provided.
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