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TI(德州仪器)
country/region:USA
Application:
Industrial applicationsconsumer electronics5G and communication networksAutomotive electronics

Texas Instruments (TI) is one of the largest semiconductor companies in the world. We remain committed to providing innovative semiconductor technologies that help our customers develop the world's most advanced electronic products. Our analog, embedded processing and wireless technologies continue to penetrate into every aspect of life, from digital communications and entertainment to medical services, automotive systems and a wide range of applications. At the beginning of TI's development, the company's goal was to use the company's unique technological capabilities to fundamentally subvert traditional markets and create new markets. A clear main line has always been running through our development process, which is to use more and more advanced real-time signal processing technology to achieve progress from quantitative change to qualitative change, and truly and continuously change the world.

Type:PCN
Time:2023-02-23
Change:Wafer Process,Wafer Site
No.:20230222000.1
Description:Qualification of RFAB as an additional Fab site option for select LBC8 devices
Type:PCN
Time:2023-02-23
Change:Wafer Process,Wafer Site
No.:20230222000.2
Description:Qualification of RFAB as an additional Fab site option for select LBC8 devices
Model:LMV358IPW
Type:PDN
Time:2023-02-23
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:20230221000.3
Description:Discontinuance of Se lect LM324 and LM358 Devices. Replacements provided.
Model:TLC272CPW
Type:PDN
Time:2023-02-23
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:20230217005.3A
Description:Updated document, Reason of update: The purpose of Revis ion A is to correct 3 of the recommended replacement parts in the Product Affected Section. Replacements provided.
Model:LMV324ID
Type:PDN
Time:2023-02-23
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:20230221000.3
Description:Discontinuance of Se lect LM324 and LM358 Devices. Replacements provided.
Model:LMV324QD
Type:PDN
Time:2023-02-23
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:20230221000.3
Description:Discontinuance of Se lect LM324 and LM358 Devices. Replacements provided.
Model:ISO1540DR
Type:PCN
Time:2023-02-23
Change:Wafer Process,Wafer Site
No.:20230222000.1
Description:Qualification of RFAB as an additional Fab site option for select LBC8 devices
Type:PCN
Time:2023-02-21
Change:Datasheet Specifications
No.:20230215006.0.A
Description:Updated document, Reason of update: The PCN is being re-issued to correct the affected device list. Datasheet for ISO6731.
Type:PCN
Time:2023-02-17
Change:Assembly Site,Test Site
No.:20230217000.2
Description:Qualification of new CDAT as an additional Assembly and Test site with a new die revision for some of the devices
Model:MAX207IDB
Type:PDN
Time:2023-02-17
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:20230217001.3
Description:Discontinuance of Se lect Devices. Replacements provided.
RFQ
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