Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.