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Laird(莱尔德)
country/region:USA
Application:
Automotive electronicsSmart security5G and communication networksmedicalIndustrial applicationssmart homeAerospacecomputerconsumer electronics

Laird is a global technology business focused on enabling wireless communications and intelligent systems, and providing protection for electronic components and systems. As a leader in the design, supply and support of innovative technologies, our products and solutions enable people, organizations, machines and applications to connect effectively, helping to build a world where smart technologies change the way we live. Our products are designed to meet the needs of a variety of applications in different industries, from medical to military. Our wireless communications technologies, for example, provide reliability and signal integrity regardless of environment and challenges. Our performance materials, too, eliminate the harmful effects of EMI or thermal damage and provide practical, proven solutions in applications where performance cannot be compromised. However, there is a need for everyone to create practical solutions to ensure the reliability of wireless communications, regardless of the environment or challenges.

Model:BTM403-01
Type:PCN
Time:2011-02-28
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Type:PCN
Time:2011-02-28
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Type:PCN
Time:2011-02-28
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Model:BTM430-01
Type:PCN
Time:2011-02-28
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Type:PCN
Time:2011-02-28
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Model:BTM431-01
Type:PCN
Time:2011-02-28
Change:Assembly Process,Product Code,Software Change
No.:
Description:Laird Technologies is releasing version 11.28.1.0 of our Bluetooth 2.0 Firmware for all AT Bluetooth modules. Version 11.28.1.0 is a comprehensive release of all previous features and bug fixes and will be the default FW loaded at production for all BT v2.0 AT modules.
Type:PCN
Time:2008-12-11
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Type:PCN
Time:2008-12-11
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Type:PCN
Time:2008-12-11
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
Type:PCN
Time:2008-12-11
Change:Assembly Process,Product Code
No.:
Description:Some products will be manufactured using a different PCB layout, this new layout incorporates the same physical footprint, but includes components on both sides of the board.
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