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Renesas(瑞萨)
country/region:Japan
Application:
Automotive electronicsIndustrial applications5G and communication networks

In April 2010, Japan's two major semiconductor manufacturers NEC Electronics and Renesas Technology merged, and a new professional semiconductor manufacturer Renesas Electronics was born. Based on its strong R&D strength, design and development platform, and various manufacturing technologies, the newly born Renesas Electronics actively promotes and strengthens the development of the three major product areas of MCU, system LSI, and analog and power semiconductor devices. Its products are widely used in various product fields such as energy-saving home appliances, environmentally friendly vehicles, AV/PC, mobile communication equipment, industrial/FA, and intelligent networks.

Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-14
Change:产品变更通告
No.:HMDD-3760
Description:Standardization of wafer process for RH850/U2Ax and E2x Series (HMDD-3760)
Type:PCN
Time:2024-06-13
Change:产品变更通告
No.:PCN240009
Description:PCN# : 240009 Change in solder ball materials and substrate manufacturing location
Type:PCN
Time:2024-06-13
Change:产品变更通告
No.:PCN240009
Description:PCN# : 240009 Change in solder ball materials and substrate manufacturing location
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