Change:Assembly Process
No.:PCN-20230069
Description:In order to avoid material shortage issue, OPS/ALED would like to change below Parts chip.
Change:Assembly Process
No.:PCN-20230069
Description:In order to avoid material shortage issue, OPS/ALED would like to change below Parts chip.
Change:Assembly Process
No.:PCN-20230069
Description:In order to avoid material shortage issue, OPS/ALED would like to change below Parts chip.
Change:Assembly Process
No.:PCN-20230069
Description:In order to avoid material shortage issue, OPS/ALED would like to change below Parts chip.
Change:Assembly Process
No.:PCN-20230069
Description:In order to avoid material shortage issue, OPS/ALED would like to change below Parts chip.
Change:Assembly Process
No.:PCN-20230069
Description:In order to avoid material shortage issue, OPS/ALED would like to change below Parts chip.
Change:Assembly Process
No.:PCN-20230069
Description:In order to avoid material shortage issue, OPS/ALED would like to change below Parts chip.
Change:Assembly Process,Characteristics Change
No.:PCN-20230215
Description:LITEON announced the change of IC used in LTST-E563CEGBW and LTST-G563EGBW-HM2.
Change:Assembly Process,Characteristics Change
No.:PCN-20230215
Description:LITEON announced the change of IC used in LTST-E563CEGBW and LTST-G563EGBW-HM2.
Change:Assembly Process
No.:PCN-20230029
Description:Lite-On would like to add second source of lead frame for PLCC T18X series as below table.