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Website:www.lem.com
country/region:Switzerland
Application:
Automotive electronicsPower and energyIndustrial applications
(Liaisons Electroniques et Mecaniques) is a large multinational group and a global leader in the field of current and voltage sensing. LEM manufactures cost-effective Hall effect isolated current and voltage sensors that are used in a wide range of power electronics applications in the industrial, automotive and rail markets, such as uninterruptible power supplies, switch mode power supplies, converters, motor drives and Battery monitoring, etc. Current and voltage sensors are used to measure DC, AC and complex waveform signals and provide electrical isolation. These products are designed to the most stringent standards and manufactured in world-class manufacturing facilities located in the United States, Europe and Japan.
Change:Assembly Process,Assembly Site
No.:PCN-043_2019_2-OMTxxx
Description:Updated document, Reason of update:adding A comparison pages between EME6600 vs G600 molding materials,Packager supplier change for the packaged SIL4 ASIC used inside the products.The material used for the ASIC SIL 4 package from the new supplier will be different vs before for the 0165#, HAIS, HMS, HXS, HAFS, 0173#, 0187# and HFWS series.
Change:Assembly Process,Assembly Site
No.:PCN-043_2019_2-OMTxxx
Description:Updated document, Reason of update:adding A comparison pages between EME6600 vs G600 molding materials,Packager supplier change for the packaged SIL4 ASIC used inside the products.The material used for the ASIC SIL 4 package from the new supplier will be different vs before for the 0165#, HAIS, HMS, HXS, HAFS, 0173#, 0187# and HFWS series.
Change:Assembly Process,Assembly Site
No.:PCN-043_2019_2-OMTxxx
Description:Updated document, Reason of update:adding A comparison pages between EME6600 vs G600 molding materials,Packager supplier change for the packaged SIL4 ASIC used inside the products.The material used for the ASIC SIL 4 package from the new supplier will be different vs before for the 0165#, HAIS, HMS, HXS, HAFS, 0173#, 0187# and HFWS series.
Change:Assembly Process,Assembly Site
No.:PCN-043_2019_2-OMTxxx
Description:Updated document, Reason of update:adding A comparison pages between EME6600 vs G600 molding materials,Packager supplier change for the packaged SIL4 ASIC used inside the products.The material used for the ASIC SIL 4 package from the new supplier will be different vs before for the 0165#, HAIS, HMS, HXS, HAFS, 0173#, 0187# and HFWS series.
Change:Assembly Process,Materials
No.:PCN-082_2017_1-OMTB1620204+B1621601+B1718701
Description:Plastic case and cover material from Grilon to Frianyl + supplier.Magnetic core second supplier.Second source supplier for output pins connector.
Change:Assembly Process,Materials
No.:PCN-082_2017_1-OMTB1620204+B1621601+B1718701
Description:Plastic case and cover material from Grilon to Frianyl + supplier.Magnetic core second supplier.Second source supplier for output pins connector.
Change:Assembly Process,Materials
No.:PCN-082_2017_1-OMTB1620204+B1621601+B1718701
Description:Plastic case and cover material from Grilon to Frianyl + supplier.Magnetic core second supplier.Second source supplier for output pins connector.
Change:Assembly Process,Assembly Site
No.:PCN-043_2019_2-OMTxxx
Description:Updated document, Reason of update:adding A comparison pages between EME6600 vs G600 molding materials,Packager supplier change for the packaged SIL4 ASIC used inside the products.The material used for the ASIC SIL 4 package from the new supplier will be different vs before for the 0165#, HAIS, HMS, HXS, HAFS, 0173#, 0187# and HFWS series.
Change:Assembly Process,Assembly Site
No.:PCN-043_2019_2-OMTxxx
Description:Updated document, Reason of update:adding A comparison pages between EME6600 vs G600 molding materials,Packager supplier change for the packaged SIL4 ASIC used inside the products.The material used for the ASIC SIL 4 package from the new supplier will be different vs before for the 0165#, HAIS, HMS, HXS, HAFS, 0173#, 0187# and HFWS series.
Change:Assembly Process,Assembly Site
No.:PCN-043_2019_2-OMTxxx
Description:Updated document, Reason of update:adding A comparison pages between EME6600 vs G600 molding materials,Packager supplier change for the packaged SIL4 ASIC used inside the products.The material used for the ASIC SIL 4 package from the new supplier will be different vs before for the 0165#, HAIS, HMS, HXS, HAFS, 0173#, 0187# and HFWS series.
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