Change:Assembly Site,Materials
No.:PCN03044
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb Quad SPI BGA-24 package.
Change:Assembly Site,Materials
No.:PCN03044
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb Quad SPI BGA-24 package.
Change:Assembly Site,Materials
No.:PCN03044
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb Quad SPI BGA-24 package.
Change:Assembly Site,Materials
No.:PCN03044
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb Quad SPI BGA-24 package.
Change:Marking Molding
No.:PCN03043
Description:Everspin is adding a character to the trace code on all Everspin products to identify CMOS wafer Fab supplier.
Change:Assembly Site,Materials
No.:PCN02952
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb(x16) and 4Mb (x8 and x16) MRAM BGA package.
Change:Assembly Site,Materials
No.:PCN02952
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb(x16) and 4Mb (x8 and x16) MRAM BGA package.
Change:Assembly Site,Materials
No.:PCN02952
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb(x16) and 4Mb (x8 and x16) MRAM BGA package.
Change:Assembly Site,Materials
No.:PCN02952
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb(x16) and 4Mb (x8 and x16) MRAM BGA package.
Change:Assembly Site,Materials
No.:PCN02952
Description:Everspin is adding OSE as a qualified assembly site for the 1Mb(x16) and 4Mb (x8 and x16) MRAM BGA package.