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country/region:USA
Application:
Automotive electronicsAerospacerail transitIndustrial applicationscomputer5G and communication networks

Vicor designs, manufactures and sells modular power components and power conversion solutions for a wide range of applications in aerospace, defense, high-performance computing, industrial equipment and automation, telecommunications, network infrastructure, and vehicles and transportation. Engineers can use the comprehensive advantages of Vicor products to design compact, high-performance, cost-effective power solutions, while simplifying the development cycle and accelerating product time to market.

Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Model:CM ChiP
Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Model:SM ChiP
Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Type:PCN
Time:2024-01-02
Change:Assembly Site
No.:VI20240102
Description:We are pleased to inform you that all plating processes enabling 3D Interconnect (3DI) have been transferred from our outside partner to Vicor at our 400 Federal Street campus.
Model:VE-HAM-EM
Type:PCN
Time:2023-05-19
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:VE20230519
Description:The purpose of this notice is to make you aware that the VI-HAM modules are being discontinued. some Replacements provided.
Type:PCN
Time:2023-05-19
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:VE20230519
Description:The purpose of this notice is to make you aware that the VI-HAM modules are being discontinued. some Replacements provided.
RFQ
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