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Website:www.semtech.com
country/region:USA
Application:
consumer electronicsAerospacemedicalsmart home5G and communication networks
Semtech Corporation is a leading supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms. The company is committed to providing proprietary solutions and breakthrough technologies for circuit protection (TVS), high reliability, power management, professional AV, signal integrity, smart sensing, video, wireless charging, wireless radio frequency, etc. Semtech's products are used in the following applications: automotive, broadcast equipment, data centers, PONs, industrial, IoT (Internet of Things), LCD TVs, smartphones, tablets, wearables and wireless infrastructure.
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:EOL-000373
Description:PRODUCT DISCONTINUANCE NOTIFICATION. No replacements provided.
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Assembly Process
No.:PCN-000826
Description:Semtech has qualified its tier 2 supplier to change the substrate's Ni/Au plating process from TSG (Traditional Selective Gold) to DPS (Double Pattern Sputter).
Change:Obsolescence Notices,Removed from Cost Book-NC/NR
No.:EOL-000373
Description:PRODUCT DISCONTINUANCE NOTIFICATION. No replacements provided.
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