Change:Assembly Site,Test Site
No.:PCN-000464.r1
Description:Semtech has qualified additional manufacturing capacity for Protection Products. A second assembly facility has been brought on line that duplicates our current assembly manufacturing processes.
Change:Wafer Process,Wafer Site
No.:PCN-000870
Description:Semtech PN RCLAMP2402B.TCT is being migrated from ASMC 5" wafer fab to ASMC 8" wafer fab.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.
Change:Packing
No.:PCN-000872
Description:KYEC, Semtech's supplier, has decided to switch from Hwa Shu to Advantek as the new supplier of cover tape. Only the packing material will change, nothing about the device.