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In September 2015, we at Aplink were separated from Seiko Electronics Co., Ltd., a subsidiary of Seiko Holdings Group, and established Seiko Semiconductor Co., Ltd., and began to officially operate independently as a professional analog semiconductor manufacturer. After ushering in the change of Japan's policy investment bank becoming the largest shareholder, we took a new first step in January 2018 by adopting the new company name of Aplink Co., Ltd.
Change:Assembly Process,Form
No.:7/2023
Description:This is to inform you that we have to change the out-of-paper sensor for the listed items due to the discontinuation from the manufacturer.
Change:Assembly Process,Form
No.:7/2023
Description:This is to inform you that we have to change the out-of-paper sensor for the listed items due to the discontinuation from the manufacturer.
Change:Assembly Process,Form
No.:7/2023
Description:This is to inform you that we have to change the out-of-paper sensor for the listed items due to the discontinuation from the manufacturer.
Change:Assembly Process,Form
No.:7/2023
Description:This is to inform you that we have to change the out-of-paper sensor for the listed items due to the discontinuation from the manufacturer.
Change:Reactivation Notices
No.:
Description:part is not EOL - ABLIC can support it.
Change:Assembly Process,Datasheet Specifications,Software Change
No.:6/2023
Description:This is to inform you that we will change the recommended motor driver IC as well as the firmware and peripheral circuits for the listed items.
Change:Assembly Process,Datasheet Specifications,Software Change
No.:6/2023
Description:This is to inform you that we will change the recommended motor driver IC as well as the firmware and peripheral circuits for the listed items.
Change:Assembly Process,Datasheet Specifications,Software Change
No.:6/2023
Description:This is to inform you that we will change the recommended motor driver IC as well as the firmware and peripheral circuits for the listed items.
Change:Assembly Process,Datasheet Specifications,Software Change
No.:6/2023
Description:This is to inform you that we will change the recommended motor driver IC as well as the firmware and peripheral circuits for the listed items.
Change:Assembly Process,Datasheet Specifications,Software Change
No.:6/2023
Description:This is to inform you that we will change the recommended motor driver IC as well as the firmware and peripheral circuits for the listed items.
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