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自1974以来，Central半导体已经去公司为世界各地的客户谁想要创新和可靠的半导体分立器件，并且提供最先进的半导体分立器件高科技产品，同时中央继续生产老工艺装置的长生命周期的产品很多。
型号
类型
变更时间
变更类型
变更编号
变更文件
变更说明
PCN
2003-01-20
Assembly Process
103
Device will no longer be manufactured with the TO-92-18R lead form and is offered as a standard TO-92 device For customers requiring the lead formed device, lead forming is still available from the factory at an additional cost.
PCN
2001-11-12
Assembly Process
102
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Assembly Process
102
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Packing
101
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Packing
101
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Assembly Process
102
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Packing
101
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Assembly Process
102
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Assembly Process
102
Reduced thickness (height) of the epoxy body.
PCN
2001-11-12
Assembly Process
102
Reduced thickness (height) of the epoxy body.
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