变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Final Product/Process Change Notification
变更编号:FPCN23597XJ
变更说明:Conversion of select onsemi, Czech Republic (Roznov) wafer fab technologies from 150mm to 200mm wafer diameter for UCX84X family devices.
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN23660XH
变更说明:Additional wafer fabrication facility for ONBCD25 technology in onsemi Aizu located in Aizu, Japan.
变更类型:Initial Product/Process Change Notification
变更编号:IPCN23660XH
变更说明:Additional wafer fabrication facility for ONBCD25 technology in onsemi Aizu located in Aizu, Japan.