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变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Final Product/Process Change Notification
变更编号:FPCN23597XJ
变更说明:Conversion of select onsemi, Czech Republic (Roznov) wafer fab technologies from 150mm to 200mm wafer diameter for UCX84X family devices.
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Initial Product/Process Change Notification
变更编号:IPCN25380X
变更说明:Qualification of Minigates Vanguard die in MicroPak and MicroPak 2 Package
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
变更类型:Wafer Process
变更编号:FPCN24945XB
变更说明:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
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