Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:Assembly Process,Assembly Site
No.:PCN_FT_008
Description:In order to improve production yield, the processing of the FT232R/FT245R silicon has moved from one FAB to another of the same silicon foundry. This foundry uses an identically equivalent process. FTDI have made a minor modification to the analogue circuitry within the design to match the new FAB.
Change:
No.:PCN_FT_008
Description:The present Rev-B of this device will be replaced by Rev-C of the device.