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FTDI(飞特帝亚)
国家/区域:U.K.
应用领域:
Industrial applicationssmart homeconsumer electronicsmedicalPower and energyAutomotive electronics5G and communication networks

FTDI Chip develops innovative silicon solutions that leverage the latest technologies for enhanced interactivity. Guided by the philosophy of "designed to create simplicity," the company is able to support engineers with highly complex, feature-rich, rugged and simple-to-use product platforms. FTDI Chip has a long history of growing its Universal Serial Bus (USB) product line and has some of the most recognized products in the world. The company's Embedded Video Engine (EVE) graphics controller packages display, audio and touch functionality in a single chip, significantly reducing development time and bill of materials costs required for human-machine interface (HMI) implementations. FTDI Chip also offers a family of highly differentiated, speed-optimized microcontrollers that further enhance connectivity capabilities. FTDI Chip is a fabless semiconductor company headquartered in Glasgow, UK, with R&D facilities in Glasgow, Singapore and Taipei (Taiwan, China), and regional sales in Glasgow, Taipei, Portland (Oregon, USA) and Shanghai (China) and technical support department.

型号:FT245RQ
类型:PCN
变更时间:2011-02-14
变更类型:
变更编号:PCN_FT_008
变更说明:The present Rev-B of this device will be replaced by Rev-C of the device.
型号:FT245RL
类型:PCN
变更时间:2011-02-14
变更类型:
变更编号:PCN_FT_008
变更说明:The present Rev-B of this device will be replaced by Rev-C of the device.
型号:FT232RL
类型:PCN
变更时间:2011-02-14
变更类型:
变更编号:PCN_FT_008
变更说明:The present Rev-B of this device will be replaced by Rev-C of the device.
型号:FT4232HQ
类型:PCN
变更时间:2011-02-01
变更类型:Assembly Process,Marking Molding,Product Code
变更编号:PCN_FT_007
变更说明:The mini modules PCB have been redesigned to accept the equivalent FT2232H and the FT4232H LQFP package rather than the existing QFN package,A ground test point has been added to aid debug,The PCB is now at Revision 1.1
型号:FT2232HQ
类型:PCN
变更时间:2011-02-01
变更类型:Assembly Process,Marking Molding,Product Code
变更编号:PCN_FT_007
变更说明:The mini modules PCB have been redesigned to accept the equivalent FT2232H and the FT4232H LQFP package rather than the existing QFN package,A ground test point has been added to aid debug,The PCB is now at Revision 1.1
类型:PCN
变更时间:2011-02-01
变更类型:
变更编号:PCN_FT_007
变更说明:Modules have been redesigned to use the LQFP package, replacing the QFN package.
类型:PCN
变更时间:2011-02-01
变更类型:
变更编号:PCN_FT_007
变更说明:Modules have been redesigned to use the LQFP package, replacing the QFN package.
型号:VNC2-48Q1x
类型:PCN
变更时间:2010-08-19
变更类型:
变更编号:PCN_FT_006
变更说明:Silicon modifications have resulted in the device being updated to Revision B
型号:VNC2-64L1x
类型:PCN
变更时间:2010-08-19
变更类型:
变更编号:PCN_FT_006
变更说明:Silicon modifications have resulted in the device being updated to Revision B
型号:VNC2-32L1x
类型:PCN
变更时间:2010-08-19
变更类型:
变更编号:PCN_FT_006
变更说明:Silicon modifications have resulted in the device being updated to Revision B
RFQ
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