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强茂股份有限公司成立于1986年5月强茂拥有半导体上下游整合与自有核心技术的优势，主要从事整流二极管、功率半导体、突波抑制器等分离式元件产品的生产；搭配洞察市场趋势的观察力，不断推出符合市场需求的薄型化封装。
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
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