变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Materials
变更编号:2312002-AU
变更说明:With the optimizing process flow and facilities automation, PANJIT will changeSMA package device to a new in-line (die, soldering, trimming and forming)
变更类型:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
变更编号:2303002
变更说明:This PCN is being issued to announce the qualification of PANJIT Semiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as an alternate assembly and test site for SOT-363 selected products.
变更类型:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
变更编号:2303003
变更说明:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
变更类型:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
变更编号:2303003
变更说明:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
变更类型:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
变更编号:2303003
变更说明:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.
变更类型:Assembly Process,Assembly Site,Marking Molding,Materials,Packing,Test Site,Wafer Process
变更编号:2303003
变更说明:This PCN is being issued to announce the qualification of PANJITSemiconductor (Xuzhou) Co., Ltd (located in Jiangsu Province, China) as analternate assembly and test site for SOT-23 selected products.