变更类型:Assembly Process
变更编号:Quectel_PCN_2019051303
变更说明:In addition to the current Hynix eMCP (H9TQ64A8GTDCUR-KUM) and Micron eMCP (MT29TZZZ8D5JKERL-107 W.95E), Samsung eMCP (KMFN60012M-B214) is added as an alternative component for Quectel SC20-CE and SC20-W modules to meet the market demand.
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051303
变更说明:In addition to the current Hynix eMCP (H9TQ64A8GTDCUR-KUM) and Micron eMCP (MT29TZZZ8D5JKERL-107 W.95E), Samsung eMCP (KMFN60012M-B214) is added as an alternative component for Quectel SC20-CE and SC20-W modules to meet the market demand.
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051303
变更说明:In addition to the current Hynix eMCP (H9TQ64A8GTDCUR-KUM) and Micron eMCP (MT29TZZZ8D5JKERL-107 W.95E), Samsung eMCP (KMFN60012M-B214) is added as an alternative component for Quectel SC20-CE and SC20-W modules to meet the market demand.
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).