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Quectel Wireless Solutions is the leading global supplier of industrial-grade cellular and GNSS modules, which can be widely applied in IoT markets, such as automobile, smart metering, remote control, asset tracking, wireless POS, security and healthcare.Quectel’s comprehensive product portfolio includes LTE, LTE-A, LPWA, UMTS/HSPA(+), GSM/GPRS and GNSS modules.The company boasts a technical management team and a strong R&D team, all of whom have rich experiences in telecommunication sector, so we understand very well where the technology will lead us and what the customers really want.
变更类型:Assembly Process
变更编号:Quectel_PCN_2019051304
变更说明:Qualcomm has licensed TSMC to second-source its WCN3610 (WCN-3610-1).
变更类型:Labeling
变更编号:PCN_MC60_2017100902_EN
变更说明:Changed paper label into laser engraved label on shielding cover
变更类型:Labeling
变更编号:PCN_MC60_2017100902_EN
变更说明:Changed paper label into laser engraved label on shielding cover
变更类型:Product Code,Wafer Process
变更编号:PCN_UC20_Series_2017072001_EN
变更说明:The wafer manufacturer has stopped the production of wafers for MCP with 60nm DRAM, and thus a new version MCP with 40nm DRAM is used alternatively.,Replacements provided.
变更类型:Product Code,Wafer Process
变更编号:PCN_UC20_Series_2017072001_EN
变更说明:The wafer manufacturer has stopped the production of wafers for MCP with 60nm DRAM, and thus a new version MCP with 40nm DRAM is used alternatively.,Replacements provided.
变更类型:Product Code,Wafer Process
变更编号:PCN_UC20_Series_2017072001_EN
变更说明:The wafer manufacturer has stopped the production of wafers for MCP with 60nm DRAM, and thus a new version MCP with 40nm DRAM is used alternatively.,Replacements provided.
变更类型:Product Code,Wafer Process
变更编号:PCN_UC20_Series_2017072001_EN
变更说明:The wafer manufacturer has stopped the production of wafers for MCP with 60nm DRAM, and thus a new version MCP with 40nm DRAM is used alternatively.,Replacements provided.
变更类型:Product Code,Wafer Process
变更编号:PCN_UC20_Series_2017072001_EN
变更说明:The wafer manufacturer has stopped the production of wafers for MCP with 60nm DRAM, and thus a new version MCP with 40nm DRAM is used alternatively.,Replacements provided.
变更类型:Product Code,Wafer Process
变更编号:PCN_UC20_Series_2017072001_EN
变更说明:The wafer manufacturer has stopped the production of wafers for MCP with 60nm DRAM, and thus a new version MCP with 40nm DRAM is used alternatively.,Replacements provided.
变更类型:Product Code,Wafer Process
变更编号:PCN_UC20_Series_2017072001_EN
变更说明:The wafer manufacturer has stopped the production of wafers for MCP with 60nm DRAM, and thus a new version MCP with 40nm DRAM is used alternatively.,Replacements provided.
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