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国家/区域:英国
Global Connector Technology Limited (GCT) 是标准化和定制化互联产品的领先供应商。GCT 专注于提供可靠的高质量连接器，适用于移动和无线通信、计算机和外围设备、数字娱乐、网络、工业、自动化、安保、医疗、仪器和其他消费类电子产品。GCT 利用全球大量资源来满足当地、地区和全球范围内的客户需求。GCT 在欧洲、亚洲和美洲均设有完善的销售、产品开发和制造基地。
变更类型:Datasheet Specifications
变更编号:FFC2B25-001
变更说明:1. Fitting nail change impacts dimension A - no PCB layout change required.2. Tooled parts amendment.3. Number of available contacts expanded.4. Contact tolerance changed from +/-0.15 to +/-0.03
变更类型:Datasheet Specifications
变更编号:FFC2B25-001
变更说明:1. Fitting nail change impacts dimension A - no PCB layout change required.2. Tooled parts amendment.3. Number of available contacts expanded.4. Contact tolerance changed from +/-0.15 to +/-0.03
变更类型:Datasheet Specifications
变更编号:FFC2B25-001
变更说明:1. Fitting nail change impacts dimension A - no PCB layout change required.2. Tooled parts amendment.3. Number of available contacts expanded.4. Contact tolerance changed from +/-0.15 to +/-0.03
变更类型:Datasheet Specifications
变更编号:FFC2B25-001
变更说明:1. Fitting nail change impacts dimension A - no PCB layout change required.2. Tooled parts amendment.3. Number of available contacts expanded.4. Contact tolerance changed from +/-0.15 to +/-0.03
变更类型:Obsolescence Notices
变更编号:USB1010-001
变更说明:Worn tooling and low sales make tooling maintenance commercially unviable. Alternatives provided.
变更类型:Packing
变更编号:SIM5051-003
变更说明:Reel size changes from 1,000 to 700. Carton size changes from 6,000 to 5,600.
变更类型:Packing
变更编号:BB080-001
变更说明:6 8 position versions no longer available in D tube or E tube with cap packging. They will be supplied in G box packaging
变更类型:Assembly Process
变更编号:BC045-001
变更说明:1. Pin pitch tolerance on contact area change from 0.05mm to 0.10mm 2. Row pitch tolerance on contact area change from 0.05mm to 0.10mm 3. Pin pitch tolerance on solder area change from 0.05mm to 0.10mm 4. Row pitch tolerance on solder area change from 0.05mm to 0.15mm
变更类型:Assembly Process,Datasheet Specifications
变更编号:USB3065-001
变更说明:Plastic peg height changes from 0.55mm to 0.35mm.Position of peg changes from 2.15mm to 2.25mm from SMT holdown centreline.Rear body dimension change 2.8mm to 2.85mm.Other minor dimensional changes
变更类型:Assembly Process,Datasheet Specifications
变更编号:USB3065-001
变更说明:Plastic peg height changes from 0.55mm to 0.35mm.Position of peg changes from 2.15mm to 2.25mm from SMT holdown centreline.Rear body dimension change 2.8mm to 2.85mm.Other minor dimensional changes
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