变更类型:Packing
变更编号:BC070-001
变更说明:Packaging improvement, change from square mylar film to circular mylar film.
变更类型:Packing
变更编号:BC070-001
变更说明:Packaging improvement, change from square mylar film to circular mylar film.
变更类型:Errata
变更编号:BF090-001
变更说明:Overall height changes from 4.5mm to 4.3mm. Insulator height change from 4.3mm to 4.0mm. PCB solder pad dimension changed from 1.95mm to 2.10mm - No impact on customers using rev E layout.Socket entry dimension added.Extra tolerances added.
变更类型:Errata
变更编号:BF090-001
变更说明:Overall height changes from 4.5mm to 4.3mm. Insulator height change from 4.3mm to 4.0mm. PCB solder pad dimension changed from 1.95mm to 2.10mm - No impact on customers using rev E layout.Socket entry dimension added.Extra tolerances added.
变更类型:Errata
变更编号:BF090-001
变更说明:Overall height changes from 4.5mm to 4.3mm. Insulator height change from 4.3mm to 4.0mm. PCB solder pad dimension changed from 1.95mm to 2.10mm - No impact on customers using rev E layout.Socket entry dimension added.Extra tolerances added.
变更类型:Errata
变更编号:BF090-001
变更说明:Overall height changes from 4.5mm to 4.3mm. Insulator height change from 4.3mm to 4.0mm. PCB solder pad dimension changed from 1.95mm to 2.10mm - No impact on customers using rev E layout.Socket entry dimension added.Extra tolerances added.
变更类型:Datasheet Specifications,Errata
变更编号:BF080-001
变更说明:Plastic peg length change from 1.0mm to 1.3mm.Plastic peg diameter change from 1.0mm to 0.8mm.PCB layout change, hole diameter changes from 1.30mm to 1.00mm.
变更类型:Errata
变更编号:BF090-001
变更说明:Overall height changes from 4.5mm to 4.3mm. Insulator height change from 4.3mm to 4.0mm. PCB solder pad dimension changed from 1.95mm to 2.10mm - No impact on customers using rev E layout.Socket entry dimension added.Extra tolerances added.
变更类型:Obsolescence Notices
变更编号:SIM2055-001
变更说明:2.0mm height version is no longer available. Replacements provided.
变更类型:Packing
变更编号:BG046-002
变更说明:Change to packing options