Change:Materials,Wafer Site
No.:IPCN25451X
Description:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
Change:Materials,Wafer Site
No.:IPCN25451X
Description:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
Change:Assembly Site,Materials,Test Site
No.:FPCN25132X
Description:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
Change:Assembly Site,Materials,Test Site
No.:FPCN25132X
Description:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
Change:Wafer Process
No.:FPCN24945XB
Description:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
Change:Wafer Process
No.:FPCN24945XB
Description:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
Change:Wafer Process
No.:FPCN24945XB
Description:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
Change:Wafer Process
No.:FPCN24945XB
Description:Improve FAB process variation of SuperFET3 FRFET by optimizing Mask design
Change:Assembly Site,Materials,Test Site
No.:FPCN25132X
Description:TO247 Assembly and Test Qualification of Shantou Huashan (SHEDCL), China for capacity expansion.
Change:Assembly Process
No.:IPCN25057X
Description:Qualify 2nd source glass supplier PTOT at ASEM.