Change:Assembly Site,Materials,Product Code,Wafer Site
No.:IPCN25255X
Description:Qualification of Minigates Vanguard die in uDFN6/8 Package
Change:Assembly Site,Materials,Packing
No.:IPCN25336X
Description:Qualification Assembly site in UTAC Thailand
Change:Wafer Site
No.:IPCN25373X
Description:Wafer FAB site transfer of HDG4D, HDG4DA and HDJ4 Technology from BK6, Korea to AIZU, Japan
Change:Materials,Wafer Site
No.:IPCN25451X
Description:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
Change:Materials,Wafer Site
No.:IPCN25451Z
Description:Qualification of onsemi Aizu Japan as wafer Fab for ONC25 Technology.
Change:Assembly Process
No.:IPCN25057X
Description:Qualify 2nd source glass supplier PTOT at ASEM.
Change:Materials,Wafer Site
No.:IPCN25286X
Description:This Initial Notification announces that onsemi is qualifying Vanguard wafer fabrication for SOT5 and SOT9 packages.
Change:Wafer Process,Wafer Site
No.:IPCN25297Z
Description:Transfer wafer fabrication from Gresham to Aizu for NCD570x family of gate driver products.
Change:Assembly Site,Marking Molding,Test Site,Wafer Site
No.:IPCN25300Z1
Description:Updated document, Reason of update: Update to IPCN25300Z - To remove the JS Foundry, Japan in Before and After change table.
Change:Materials
No.:IPCN25344X
Description:Those affected OPNs change bonding wire from Gold to Palladium Coated Copper (PCC) wire interconnect.